Moving apparatus, exposure apparatus, and device manufacturing method

ABSTRACT

A moving apparatus includes a first actuator having a movable element and a stator, and a second actuator for driving the stator. The second actuator drives the stator in a direction to suppress rotation of the stator which accompanies movement of the movable element.

FIELD OF THE INVENTION

[0001] The present invention relates to a moving apparatus, exposureapparatus, and device manufacturing method.

BACKGROUND OF THE INVENTION

[0002] In recent years, demand has arisen for higher-accuracy controlfor a moving apparatus which moves with an object such as a structureplaced on its stage. For example, with an exposure apparatus used forthe manufacture of semiconductor devices or the like, as the integrationdensity of the semiconductor devices increases, a higher-accuracymicropatterning technique is demanded. In order to realize this, amoving apparatus such as a wafer stage must be controlled at highaccuracy.

[0003] Typical examples of an exposure apparatus used for themanufacture of semiconductor devices include a step-and-repeat exposureapparatus (to be referred to as a “stepper” hereinafter) and astep-and-scan exposure apparatus (to be referred to as a “scanner”hereinafter).

[0004] A stepper is an exposure apparatus that sequentially exposes thepattern of a master (e.g., a reticle, mask, or the like) onto aplurality of exposure regions on a substrate (e.g., a wafer, glasssubstrate, or the like), used for manufacturing semiconductor devices,through a projection optical system while stepping the substrate.

[0005] A scanner is an exposure apparatus that repeats exposure andtransfer onto the plurality of regions on the substrate by repeatingstepping and scanning exposure. The scanner limits exposure light with aslit, so that it uses that portion of a projection optical system whichis relatively close to the optical axis. For this reason, generally, thescanner can expose a fine pattern with a wider angle of view at higheraccuracy than with the stepper.

[0006] Such an exposure apparatus has a stage (e.g., a wafer stage,reticle stage, or the like) for moving a wafer or reticle at a highspeed. When the stage is driven, a reaction force of an inertial forceaccompanying acceleration and deceleration of the stage occurs. When thereaction force is transmitted to the stage surface plate, the stagesurface plate swings or vibrates. Consequently, characteristic vibrationis excited in the mechanical system of the exposure apparatus togenerate high-frequency vibration. This vibration interferes withhigh-accuracy control for the moving apparatus.

[0007] To decrease the vibration of the apparatus caused by the reactionforce, a moving apparatus as shown in FIG. 6 is proposed. As shown inFIG. 6, a conventional moving apparatus has a stage 51 and a movablebody (to be referred to as “counter” hereinafter) 52 for canceling thereaction force. The stage 51 and counter 52 are driven by feedbackcontrol controlling a position in the Y direction, and a target value isgiven such that the ratio of the moving distance of the stage 51 in theY direction to that of the counter 52 in the Y direction issubstantially constant. This improves the canceling efficiency for thereaction force of the stage 51.

[0008] With the conventional moving apparatus, however, as shown in FIG.6, it is difficult to overlay the power point in the X direction of thestage 51 and the barycenter in the X direction of the counter 52completely. Hence, due to the displacement in the X direction of thepower point of the stage 51 and the barycenter of the counter 52, whenthe stage 51 moves in the Y direction, a moment is produced in thecounter 52, and the counter 52 rotates. Therefore, with the conventionalmoving apparatus, it is difficult to control positioning of the stage athigh accuracy.

SUMMARY OF THE INVENTION

[0009] The present invention has been made in view of the above problem,and has as its object to control, e.g., positioning of a stage at highaccuracy.

[0010] The first aspect of the present invention relates to a movingapparatus, characterized by comprising a first actuator having a movableelement and a stator, a second actuator which drives the stator, whereinthe second actuator drives the stator in a direction to suppressrotation of the stator which accompanies movement of the movableelement. The second actuator comprises an actuator which drives thestator in the Y direction and an actuator which drives the stator in theX and θ direction.

[0011] A preferred embodiment of the present invention preferablycomprises a feed forward compensator which controls the second actuatoron the basis of a signal supplied to the first actuator or a physicalquantity of movable element.

[0012] A preferred embodiment of the present invention furtherpreferably comprises a compensator which controls the second actuator onthe basis of an acceleration of the movable element.

[0013] According to a preferred embodiment of the present invention, atarget acceleration is preferably used as the acceleration of themovable element.

[0014] According to a preferred embodiment of the present invention, anactual acceleration measured by a measurement unit is preferably used asthe acceleration of the movable element.

[0015] According to a preferred embodiment of the present invention, thesignal preferably includes a manipulated variable with which the firstactuator is operated.

[0016] According to a preferred embodiment of the present invention, again of the compensator is preferably determined in accordance with adistance between a power point of the movable element in a predetermineddirection and a barycenter of the stator when the movable element isdriven by the first actuator.

[0017] According to a preferred embodiment of the present invention, thestator preferably absorbs a reaction force that acts on the stator whenthe movable element is driven by the first actuator.

[0018] A second aspect of the present invention relates to an exposureapparatus, characterized by comprising an optical system which projectsexposure light to be irradiated to a master having a pattern onto asubstrate, a stage which can move while holding the substrate or themaster, a first actuator having a movable element and a stator, themovable element being connected to the stage, a second actuator whichdrives the stator in the Y direction, and a third actuator which drivesthe stator in the X and θ direction, wherein the third actuator drivesthe stator in a direction to suppress rotation of the stator whichaccompanies movement of the movable element.

[0019] A third aspect of the present invention relates to asemiconductor device manufacturing method, characterized by comprisingan applying step of applying a photosensitive material on a substrate,an exposure step of transferring a pattern onto the substrate, appliedwith the photosensitive material in the applying step, by utilizing theabove exposure apparatus, and an developing step of developing thephotosensitive material on the substrate where the pattern has beentransferred in the exposure step.

[0020] Other features and advantages of the present invention will beapparent from the following description taken in conjunction with theaccompanying drawings, in which like reference characters designate thesame or similar parts throughout the figures thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in andconstitute a part of the specification, illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

[0022]FIGS. 1A and 1B are views showing a moving apparatus according tothe first embodiment of the present invention;

[0023]FIG. 2 is a view showing in detail the moving apparatus accordingto the first embodiment of the present invention;

[0024]FIG. 3 is a control block diagram according to the firstembodiment of the present invention;

[0025]FIG. 4 is a control block diagram according to the secondembodiment of the present invention;

[0026]FIG. 5 is a control block diagram according to the thirdembodiment of the present invention;

[0027]FIG. 6 is a view showing a conventional moving apparatus;

[0028]FIG. 7 is a conceptual view of an exposure apparatus to which amoving apparatus according to a preferred embodiment of the presentinvention is applied;

[0029]FIG. 8 is a flow chart showing the flow of an overallsemiconductor device manufacturing process; and

[0030]FIG. 9 is a flow chart showing the detailed flow of the waferprocess.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] The preferred embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings. Thesame constituent elements in the drawings are denoted by the samereference numerals.

[0032] (First Embodiment)

[0033] A moving apparatus as the first preferred embodiment of thepresent invention will be described with reference to the drawings.

[0034]FIG. 1A is a plan view showing the arrangement of the movingapparatus according to a preferred embodiment of the present invention,and FIG. 1B is a sectional view of the same. As shown in FIG. 1B, a flatguide surface 6 as the reference surface of the moving apparatus isformed on a reference structure 4. A movable portion 3 is supportedabove the flat guide surface 6 in a non-contact manner by staticpressure bearings 7. As shown in FIG. 1A, the movable portion 3 can movein the Y direction along the flat guide surface 6. Electromagneticactuators 8 and 8′ for moving the movable portion 3 in the Y directionare provided on the two sides of the movable portion 3, as shown in FIG.1B. The movable portion 3 is driven by the two sets of electromagneticactuators 8 and 8′. The electromagnetic actuators 8 and 8′ includemovable elements 2 and 2′ connected to the movable portion 3 which movesalong the flat guide surface 6, and stators 1 and 1′. For example, a topplate 5 is formed on the movable portion 3. A moving target object(e.g., a wafer or the like) can be placed on the top plate 5.

[0035] The stators 1 and 1′ are supported above the flat guide surface 6in a non-contact manner by static pressure bearings 9, and can move inthe Y direction. The stators 1 and 1′ have predetermined masses, and canabsorb a reaction force generated by acceleration and deceleration ofthe movable portion 3. The stators 1 and 1′ can be formed of permanentmagnets, and the movable elements 2 and 2′ can be formed of coils.Conversely, the stators 1 and 1′ may be formed of coils, and the movableelements 2 and 2′ may be formed of permanent magnets.

[0036] One or a plurality of interferometers (not shown) are provided tocontrol the moving apparatus, and can position the movable elements 2and 2′ or movable portion 3 with reference to the reference structure 4.Similarly, an interferometer (not shown) for measuring the positions ofthe stators 1 and 1′ is provided to position the stators 1 and 1′ whichmove within a plane. In the above manner, a movable body 300 serving asa stage having the movable portion 3 (including the top plate 5 providedon it) and the movable elements 2 and 2′ can move in the Y direction ina non-contact manner with the flat guide surface 6.

[0037] When the movable body 300 moves, the stators 1 and 1′ receive thereaction force of a force acting on the movable body 300. Upon receptionof the reaction force, the stators 1 and 1′ can move along the flatguide surface 6. More specifically, the stators 1 and 1′ serve to absorbthe reaction force accompanying the driving operation of the movablebody 300 by moving along the flat guide surface 6. For example, when themovable body 300 including the movable portion 3 and the like is drivenin the +Y direction, the stators 1 and 1′ receive the reaction force inthe −Y direction and move in the −Y direction, so that they can absorbthe reaction force.

[0038] As described above, the reaction force during acceleration anddeceleration which acts on the movable body 300 when it moves can beabsorbed by the stators 1 and 1′. The reaction force is converted intokinetic energy when the stators 1 and 1′ (reaction force movableportion) which have received the reaction force move. Although twostators are provided in this case, the present invention is not limitedto this. The number of stators may be one, or three or more.

[0039] With the above arrangement, the force acting on the movable body300 and its reaction force are limited on the flat guide surface 6 ofthe reference structure 4. Hence, the reference structure 4 can beprevented from vibrating due to the driving force acting on the movablebody 300 and the reaction force acting on the stators 1 and 1′.Furthermore, according to this embodiment, vibration can be preventedfrom transmitting to the floor of the area where the moving apparatus isinstalled, or to other apparatuses.

[0040] When the masses of the stators 1 and 1′ are increasedsufficiently larger than the mass of the movable body 300 including themovable portion 3 and the like, the movable range of the stators 1 and1′ can be limited small. This enables downsizing of the apparatus, andreduces the floor area of the semiconductor factory, thus contributingto the reduction of the construction cost of the entire semiconductorfactory.

[0041] A more practical arrangement of the moving apparatus according tothe first preferred embodiment of the present invention will bedescribed. FIG. 2 shows the more practical arrangement of the movingapparatus according to the preferred embodiment of the presentinvention. As shown in FIG. 2, the flat guide surface 6 as the referencesurface of the moving apparatus is formed on the reference structure 4.The movable portion 3 (see FIG. 1B) provided under the top plate (X-Ystage) 5 is supported on the flat guide surface 6 in a non-contactmanner through the static pressure bearings 7, and can move in an X-Ydirection. The electromagnetic actuators 8 (not shown) and 8′ fordriving the movable portion 3 with a long stroke in the Y direction andwith a short stroke in the X direction are provided on the two sides ofthe movable portion 3. The electromagnetic actuators 8 and 8′ includethe movable elements 2 and 2′ and stators 1 and 1′ which are separatefrom and independent of each other on the right and left sides (seeFIGS. 1A and 1B). Two, right and left movable-portion Y magnets 10 andtwo, right and left movable-portion X magnets 11 are attached to theright and left movable elements 2 and 2′. The stators 1 and 1′ aresupported on the flat guide surface 6 in a non-contact manner throughthe static pressure bearings 8 (see FIG. 1B), and can move in the X-Ydirection (planar directions). The stators 1 and 1′ have predeterminedmasses, and can absorb the reaction force, generated by acceleration anddeceleration of the movable body 300 including the movable portion 3 andmovable elements 2 and 2′, by moving on the flat guide surface 6. X-axislinear motor single-phase coils 12 and Y-axis linear motor multiphasecoils 13 having an array of a plurality of coils in the Y direction arearranged in the stators 1 and 1′, and are switched to achieve movementin the X and Y axes.

[0042] The position of the top plate (X-Y stage) 5 is measured by alaser interferometer formed of a laser head 16, a Y-axis measurementmirror 17, an X-axis measurement bar mirror 18, left and right twoY-axis measurement detectors 19, front and rear two X-axis measurementdetectors 20, and the like. More specifically, optical elements 22 and22′ loaded on the top plate 5 are irradiated with laser beams in the Ydirection. The measurement beams are reflected or polarized in theX-axis direction to irradiate the X-axis measurement bar mirror 18, andare measured by the X-axis measurement detector 20, so that the positionin the X-axis direction of the top plate 5 is measured. The position inthe Y-axis direction of the top plate 5 is measured in the followingmanner. The Y-axis measurement mirror 17 is irradiated with a laser beamin the Y direction, and the laser beam is measured by the Y-axismeasurement detector 19. The positions in the Y-axis direction of thestators 1 and 1′ are measured by two, right and left stator Y-axismeasurement detectors 21.

[0043] The movable portion 3 in which the substrate (wafer) is placed onthe top plate (X-Y stage) 5 is moved in the X-Y direction by theelectromagnetic actuators 8 and 8′ constituted by the movable elements 2and 2′ and stators 1 and 1′. The stators 1 and 1′ receive the reactionforce of the force acting on the movable body 300 including the movableportion 3 and movable elements 2 and 2′. The stators 1 and 1′ move onthe flat guide surface 6 by the reaction force. The stators 1 and 1′ canabsorb the reaction force by moving on the flat guide surface 6. In thisembodiment, when the movable body 300 including the movable portion 3moves in the +Y direction, the stators 1 and 1′ receive the reactionforce in the −Y direction and move in the −Y direction.

[0044] Furthermore, according to this embodiment, as the actuators fordriving the stators 1 and 1′ in the Y-axis direction, two, right andleft Y-axis position control linear motors 14 and 14′ are provided tothe reference structure 4. Similarly, four, left, right, front, and rearX-axis position control linear motors 15 and 15′ for driving the stators1 and 1′ in the X-axis direction are provided to the reference structure4.

[0045] A total of four, front and rear X-direction position measurementunits (not shown) are provided, two on the left side of the support lineof the X-axis position control linear motor 15 and two on the right sideof the support line of the X-axis position control linear motor 15′, sothat the positions in the X direction of the stators 1 and 1′ can bemeasured.

[0046] A process of the moving apparatus according to the firstpreferred embodiment of the present invention will be described.

[0047]FIG. 3 is a control block diagram of the moving apparatusaccording to the first preferred embodiment of the present invention. Afeedback control system A is a feedback control system for the movableelements 2 and 2′, and a feedback control system B is a feedback controlsystem for the stators 1 and 1′. The target value R1 of the feedbackcontrol system A is fed forward to the feedback control system B via aderivative element (K*s*s).

[0048] As shown in FIG. 1B, a case will be described wherein the movableportion 3 having the top plate 5 is to be driven in the Y direction bythe electromagnetic actuators 8 and 8′ having the movable elements 2 and2′ connected to the movable portion 3 and stators 1 and 1′. The movableportion 3 is positioned when the electromagnetic actuators 8 and 8′including the movable elements 2 and 2′ and stators 1 and 1′ arefeedback-controlled on the basis of the position information of themovable portion 3 measured by the Y-axis measurement detectors 19.Reference numeral P1(s) denotes the dynamic characteristics of theelectromagnetic actuators 8 and 8′ including the movable elements 2 and2′ and stators 1 and 1′. An output from P1(s) indicates the measurementposition, i.e., a position Y1 of the movable portion 3 measured by theY-axis measurement detectors 19. A compensator C1(s) provides amanipulated variable to P1(s), i.e., the electromagnetic actuators 8 and8′ on the basis of the deviation between target value R1 and controlledvariable Y1.

[0049] As described above, the movable portion 3 can be driven to apredetermined position by causing the controlled variable (positioncontrolled variable) Y1 of the movable portion 3 to follow a targetvalue (position target value) R1 with the feedback control system A ofthe movable portion 3.

[0050] The moving apparatus according to the first preferred embodimentof the present invention has the feedback control system B forcontrolling the rotation amount on the X-Y plane of the stators 1 and1′, so that the stators 1 and 1′ are kept horizontal to the movabledirection (Y direction) of the movable portion 3. Referring to FIG. 3,reference numeral P2(s) denotes the dynamic characteristics ofelectromagnetic actuators having the linear motors 15 and 15′ and rightand left stators 1 and 1′ for driving the stators 1 and 1′. An outputfrom P2(s) indicates the measurement position, i.e., a rotation amountθ1 of the stator elements 1 and 1′. The rotation amount θ1 is calculatedby the two X-direction position measurement units (not shown) attachedto each of the stators 1 and 1′. A compensator C2(s) is arranged as aninput stage with respect to the stators 1 and 1′ serving as the controltarget. A compensator C2(s) provides a manipulated variable to P2(s),i.e., the electromagnetic actuators for driving the stators 1 and 1′ onthe basis of the deviation between target value 0 and the rotationamount θ1.

[0051] With the above arrangement, in the feedback control system B forthe stators 1 and 1′, the target value is set to 0, so that the rotationamount of the stators 1 and 1′ can be kept at 0.

[0052] According to this embodiment, as shown in FIG. 3, the derivativeelement (K*s*s) differentiates the target value R1 for controlling themovable elements 2 and 2′ and feeds forward the target accelerationcalculated from the target value to the feedback control system B whichcontrols the rotation amount of the stators 1 and 1′. Reference symbol Kdenotes the feed forward gain of a signal to be supplied to theelectromagnetic actuators of the feedback control system B. According tothis embodiment, a manipulated variable to P2(s), i.e., theelectromagnetic actuators for driving the stators 1 and 1′ is generatedby combining the target acceleration calculated by the derivativeelement (K*s*s) and the output from the compensator C2(s). Hence, in thefeedback control system B, the electromagnetic actuators for driving thestators 1 and 1′ can be controlled to suppress the rotation of thestators 1 and 1′ by applying the target acceleration calculated by thederivative element (K*s*s) to the manipulated variable in advance. Thestators 1 and 1′ can be driven in the direction to suppress theirrotation that accompanies the movement of the movable elements 2 and 2′.As a result, rotation of the stators 1 and 1′, which occurs whenaccelerating the movable elements 2 and 2′ and movable portion 3, issuppressed, so that the stage can be positioned at high accuracy.

[0053] (Second Embodiment)

[0054]FIG. 4 is a control block diagram of a moving apparatus accordingto the second preferred embodiment of the present invention. In thisembodiment, the output from the compensator C1(s) is fed forward to thefeedback control system B via a proportional element(K). As shown inFIG. 4, a manipulated variable for manipulating the electromagneticactuators 8 and 8′ of a feedback control system A is increased by afactor of N and is fed forward to a feedback control system B whichcontrols the rotation amount of stators 1 and 1′. Similarly to the firstembodiment, reference symbol K denotes the feed forward gain of a signalto be supplied to the electromagnetic actuators of the feedback controlsystem B. According to this embodiment, a manipulated variable to P2(s),i.e., the electromagnetic actuators for driving the stators 1 and 1′ isgenerated by combining the output from the compensator C1(s) beingincreased by a proportional element(K) by a factor of N and the outputfrom the compensator C2(s). Hence, in the feedback control system B, theelectromagnetic actuators for driving the stators 1 and 1′ can becontrolled to suppress the rotation of the stators 1 and 1′ by applyingthe output from the compensator C1(s) being increased by a proportionalelement(K) by a factor of N to the manipulated variable in advance.

[0055] (Third Embodiment)

[0056]FIG. 5 is a block diagram of a moving apparatus according to thethird preferred embodiment of the present invention. In this embodiment,the controlled value (position information) of the feedback controlsystem A is fed forward to the feedback control system B via aderivative element (K*s*s). As shown in FIG. 5, the derivative element(K*s*s) differentiates the position information Y1 of movable elements 2and 2′ measured by Y-axis measurement detectors 19, a feedback controlsystem A feeds forward the acceleration (actual acceleration) of themovable elements 2 and 2′ calculated from the position information to afeedback control system B which controls the rotation amount of stators1 and 1′. In the same manner as in the first and second embodiments,reference symbol K denotes the feed forward gain of a signal to besupplied to the electromagnetic actuators of the feedback control systemB. According to this embodiment, a manipulated variable to P2(s), i.e.,the electromagnetic actuators for driving the stators 1 and 1′ isgenerated by combining the actual acceleration calculated by thederivative element (K*s*s) and the output from the compensator C2(s).Hence, in the feedback control system B, the electromagnetic actuatorsfor driving the stators 1 and 1′ can be controlled to suppress therotation of the stators 1 and 1′ by applying the target accelerationcalculated by the derivative element (K*s*s) to the manipulated variablein advance. An acceleration meter may be provided in place of the Y-axismeasurement detectors 19.

[0057] (Other Embodiment)

[0058] A moving apparatus according to a preferred embodiment of thepresent invention is formed such that its movable portion 3 is movablein the X direction and the power point in the X direction of the movableportion 3 with respect to counter masses (stators) 1 and 1′ changes inaccordance with the position in the X direction of the movable portion3. In this case, the moving apparatus can be formed such that the gain(feed forward gain) of a signal to be supplied to the electromagneticactuators of a feedback control system B changes in accordance with thedistance between the power points of movable elements 2 and 2′ duringdriving in the X direction and the barycenters of the stators 1 and 1′.This enables higher-accuracy positioning control.

[0059] As described above, according to the preferred embodiment of thepresent invention, when the signal used in the control system for themovable portion is fed forward to a control system for the stators,swing, rotation, and the like of the stators which occur due toacceleration of the movable elements can be suppressed.

[0060]FIG. 7 is a conceptual view of an exposure apparatus which is usedwhen the moving apparatus according to any preferred embodiment of thepresent invention is applied to a semiconductor device manufacturingprocess. Referring to FIG. 7, a reticle 72 serving as a master isirradiated with light emerging from an illumination optical system 71.The reticle 72 is held on a reticle stage 73, and its pattern is reducedand projected with the magnification of a reduction projection lens 74to form a reticle pattern image on the image surface of the reductionprojection lens 74. The image surface of the reduction projection lens74 is perpendicular to the Z direction. A resist is applied to thesurface of a substrate 75 as an exposure target sample, and shots formedin an exposure process are arrayed on the resist. The substrate 75 isplaced on a stage 300 including a movable body and the like. The stage300 is formed of a chuck for fixing the substrate 75, an X-Y stagehorizontally movable in X- and Y-axis directions, and the like. Theposition information of the stage 300 is constantly measured by a stageinterferometer 78 with respect to a mirror 77 fixed to the stage 300.The moving apparatus according to the embodiment of the presentinvention generates a control signal from a position signal output fromthe stage interferometer 78 and the like, and controls the position ofthe stage 300.

[0061] The exposure apparatus may perform scanning and exposure oftransferring a predetermined region of the pattern of a master onto asubstrate by moving and scanning both the master and substrate withrespect to an optical system. In this case, the exposure apparatus candrive at least one of the master and substrate during scanning by meansof a stage provided to the moving apparatus according to any preferredembodiment of the present invention. Ultraviolet rays may be used as theexposure light. In this case, as the ultraviolet rays, for example, alaser beam from a fluorine eximer laser, ArF eximer laser, or the likewhich uses a laser as the light source is preferably used.

[0062] A semiconductor device manufacturing process utilizing the aboveexposure apparatus will be described. FIG. 8 is a flow chart of the flowof the overall semiconductor device manufacturing process. In step 1(circuit design), circuit design of a semiconductor device is performed.In step 2 (mask fabrication), a mask is fabricated based on the designedcircuit pattern. In step 3 (wafer fabrication), a wafer is manufacturedby using a material such as silicon. In step 4 (wafer process) called apre-process, an actual circuit is formed on the wafer by lithographyusing the prepared mask and wafer. In step 5 (assembly) called apost-process, a semiconductor chip is formed by using the waferfabricated in step 4, and includes processes such as an assembly process(dicing and bonding) and packaging process (chip encapsulation). In step6 (inspection), inspections such as the operation confirmation test anddurability test of the semiconductor device fabricated in step 5 areperformed. After these steps, the semiconductor device is completed, andshipped (step 7).

[0063]FIG. 9 is a flow chart showing the detailed flow of the waferprocess. In step 11 (oxidation), the surface of the wafer is oxidized.In step 12 (CVD), an insulating film is formed on the wafer surface. Instep 13 (electrode formation), an electrode is formed on the wafer byvapor deposition. In step 14 (ion implantation), ions are implanted inthe wafer. In step 15 (resist processing), a photosensitive agent isapplied to the wafer. In step 16 (exposure), the circuit pattern istransferred to the wafer by using the above exposure apparatus. In step17 (development), the exposed wafer is developed. In step 18 (etching),the resist is etched except for the developed resist image. In step 19(resist removal), an unnecessary resist after etching is removed. Thesesteps are repeated to form multiple circuit patterns on the wafer.

[0064] According to the present invention, for example, positioning of astage can be controlled at high accuracy.

[0065] As many apparently widely different embodiments of the presentinvention can be made without departing from the spirit and scopethereof, it is to be understood that the invention is not limited to thespecific embodiments thereof except as defined in the claims.

What is claimed is:
 1. A moving apparatus comprising: a first actuatorhaving a movable element and a stator; and a second actuator whichdrives said stator, wherein said second actuator drives said stator in adirection to suppress rotation of said stator which accompanies movementof said movable element.
 2. The apparatus according to claim 1, furthercomprising a feed forward compensator which controls said secondactuator on the basis of a signal supplied to said first actuator or aphysical quantity of movable element.
 3. The apparatus according toclaim 2, further comprising a compensator which controls said secondactuator on the basis of an acceleration of said movable element.
 4. Theapparatus according to claim 3, wherein a target acceleration is used asthe acceleration of said movable element.
 5. The apparatus according toclaim 3, wherein an actual acceleration measured by a measurement unitis used as the acceleration of said movable element.
 6. The apparatusaccording to claim 2, wherein the signal includes a manipulated variablewith which said first actuator is operated.
 7. The apparatus accordingto claim 2, wherein a gain of said compensator is determined inaccordance with a distance between a power point of said movable elementin a predetermined direction and a barycenter of said stator when saidmovable element is driven by said first actuator.
 8. The apparatusaccording to claim 1, wherein said stator absorbs a reaction force thatacts on said stator when said movable element is driven by said firstactuator.
 9. An exposure apparatus comprising: an optical system whichprojects exposure light to be irradiated to a master having a patternonto a substrate; a stage which can move while holding the substrate orthe master; a first actuator having a movable element and a stator, saidmovable element being connected to said stage; and a second actuatorwhich drives said stator, wherein said second actuator drives saidstator in a direction to suppress rotation of said stator whichaccompanies movement of said movable element.
 10. A semiconductor devicemanufacturing method comprising: an applying step of applying aphotosensitive material on a substrate; an exposure step of transferringa pattern onto the substrate, applied with the photosensitive materialin the applying step, by utilizing the exposure apparatus according toclaim 9; and a developing step of developing the photosensitive materialon the substrate where the pattern has been transferred in the exposurestep.